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Total Interference Contrast |
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Non Contact Measurement |
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Perform non-contact and vibration-free height measurements of thin layers in interference images.
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 | | Microscope based measurements |
| Examining the quality of thin layer systems places high demands on a microscopic measuring system. With TIC microscopy, Carl Zeiss offers not only optimum assessment of the sample, but also the non-contact, vibration-free and precise measurement of the heights of thin layers.
• Uncomplicated, cost-effective analysis of thin-layer samples
• Measurement of layer heights from micrometers to nanometers
• Optimum resolution |
 | | TIC thickness measurement. |
| The TIC module is integrated into AxioVision directly as an application, therefore expanding its functionality to include the measurement of the heights of thin layers. A workflow enables the user to carry out the measurement in one continuous sequence from scaling and image acquisition through to TIC measurement. |
 | | Interference image with 3 regions, from which the layer height can be determined |
| The principle of layer-height measurement is based on the measurement of the material-dependent displacement of the interference pattern. The following image of a thin-layer sample illustrates the measurement process. Three flat regions are marked in the interference image:
• A: top left-hand corner of structure of unknown height
• B: underlying surface
• C: region with displaced interference fringes |
 | | Interference image with measured height |
| The height of the structure is determined by measuring the fringe displacement in C in relation to the position of = the fringe in A or B. To do this, the user clicks at the centre of the dark zero-order interference fringe in regions A and C or B and C. The measured value is displayed directly in the image. Measured images can be stored and managed in an archive. |
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